Advertise with Power Electronics (PE)

Power Electronics (PE) delivers authoritative insight into the technologies and engineering decisions shaping the next era of electrification. Built around clearly defined technical pillars, PE connects the full power electronics ecosystem, from device physics and chip design through to modules, packaging, systems, and real-world deployment. Power electronics now sits at the centre of global infrastructure transformation. It underpins electrification across automotive, renewable energy, industrial systems, aerospace, and digital infrastructure. As demand accelerates, the focus has shifted beyond efficiency alone to power density, integration, thermal performance, reliability, and intelligent control at scale.

PE's editorial framework reflects where real engineering effort is being applied today:

• Power Module Innovation and Integration
  Advanced packaging, interconnects, and high-density module design across Si, SiC, and GaN
• Wide Bandgap Technology and Applications
  Deployment of SiC and GaN across EVs, renewables, data centres, and industrial systems
• Thermal Management and Reliability
  Cooling strategies, lifetime prediction, and performance under real operating conditions
• Application-Focused System Design
  Inverters, converters, chargers, and power architectures across automotive, grid, aerospace, and industry
• Chip and Circuit Design
  Control architectures, gate drivers, and integration of analog and digital power functions
• AI and Intelligent Power Systems
  Predictive maintenance, optimisation, and AI-driven design workflows
• Testing, Qualification and Lifecycle Performance
  Validation, compliance, and quality assurance across the full product lifecycle
• Industry and Ecosystem Insight
  Market direction, supply chain dynamics, and strategic decision-making across the sector

Growth in the sector is being driven by three structural shifts. Electrified transport is redefining requirements for high-voltage systems and power density. Renewable energy and grid modernisation are demanding scalable, grid-interactive conversion and storage. AI-driven digital infrastructure is placing new pressure on power delivery, efficiency, and thermal management at unprecedented scale. At the device level, wide bandgap materials such as SiC and GaN are extending performance boundaries. However, competitive advantage is increasingly defined at the integration layer, where packaging, thermal design, control, and system optimisation determine real-world performance and manufacturability.

PE's audience reflects this reality. It reaches power electronics engineers, system designers, semiconductor architects, packaging and thermal specialists, test and validation engineers, and senior technical decision-makers across OEMs, integrators, and the supply chain.

Through technical features, executive interviews, application case studies, and targeted webinars, PE provides a platform to engage directly with the engineers and leaders designing, specifying, and deploying next-generation power systems.

Position your brand where device innovation meets system execution.

Please email all press releases and articles to Jackie Cannon - Publisher.
jackie.cannon@angelbc.com
Supply all releases / article in word file, if images are supplied please provide them high resolution in 300 dpi.

Find out how we can help you organise and run a webinar within the power electronics industry.