Toshiba power receiver IC slashes heat generation
The company's combined CMOS-DMOS process reduces heat generation by 30 percent
Toshiba Electronics Europe (TEE) has launched the TC7761WBG, a wireless power receiver IC that complies with Qi Standard[1] Low Power Specifications version1.1. The IC will be used in wireless power supply applications, such as smartphones and mobile accessories.
ICs used in mobile applications including smartphones, are required to generate heat at low level, to prevent overheating.
The TC7761WBG is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70 percent that of an equivalent product[2] while achieving 95 percent power conversion efficiency. The IC's built-in protocol authentication circuit, includes a foreign object detection (FOD) function, eliminates the need for an external microcontroller and contributes to simplified system designs.
TC7761WBG has been Qi certified for an output power of 3.5W, and can handle a maximum output power of 5W. Shipments of mass produced chips are now available to buy.
