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Monday 8th June 2026
Navitas introduces new package for HV SiC MOSFETs
Monday 8th June 2026
QPT's AI-driven design service optimises die attach in days
Monday 8th June 2026
Toshiba launches complementary 30V dual MOSFET
Monday 8th June 2026
Infineon and Siemens partner on SiC circuit breakers
Monday 8th June 2026
KnowMade details a rapidly evolving role for GaN
Thursday 4th June 2026
CGD's 650V ICeGaN devices improve EV range
Thursday 4th June 2026
EPC targets motion systems with GaN ePower stage ICs
Thursday 4th June 2026
CSA Catapult turns research into Double Pulse Testing
Thursday 4th June 2026
JEDEC releases new SiC guidelines
Thursday 4th June 2026
Wise to unveil digital control roadmap at PCIM 2026
Thursday 4th June 2026
Rohm SiC MOSFET adopted in HVDC AI servers
Thursday 4th June 2026
Navitas shows DC-DC board at NIVDIA event
Thursday 4th June 2026
Vishay 200A module saves space in MHEVs and LEVs
Wednesday 3rd June 2026
Joint US-Taiwan initiative to scale the future of SiC
Tuesday 2nd June 2026
Fraunhofer IAF to show GaN4EmoBil module at PCIM
Tuesday 2nd June 2026
From road to rack: IDTechEx reports on 800V innovations
Tuesday 2nd June 2026
GE Aerospace qualifies SiC solutions for military vehicles
Tuesday 2nd June 2026
EPC supports NVIDIA MGX with 800V-to-12.5V design
Monday 1st June 2026
QPT starts demos of MicroDyno
Monday 1st June 2026
Rohm launches PLECS simulator
Monday 1st June 2026
PI announces PowiGaN designs for 800 VDC AI data centres
Monday 1st June 2026
Infineon introduces first 205degC SiC power module
Wednesday 27th May 2026
Polar and Nexperia partner on power MOSFET manufacturing
Wednesday 27th May 2026
EPC appoints Mouser as global distributor
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