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Tuesday 4th June 2024
TTI stocking 2 to 30A ultrafast gate drivers
Tuesday 4th June 2024
Geely signs SiC agreement with STMicroelectronics
Tuesday 4th June 2024
CoolSiC MOSFETs now in TOLT and Thin-TOLL packages
Sunday 2nd June 2024
Infineon starts final phase of Smart Power fab in Dresden
Friday 31st May 2024
ST to build world’s first fully integrated SiC facility in Italy
Thursday 30th May 2024
Sales of plug-in hybrid EVs surge
Thursday 30th May 2024
Cambridge GaN signs agreement with Taiwan's ITRI
Wednesday 29th May 2024
AKM and SAL reveal eFuse for 800V car applications
Wednesday 29th May 2024
Infineon announces next gen CoolGaN
Wednesday 29th May 2024
WeEn Semis to attend PCIM 2024
Wednesday 29th May 2024
Innoscience to talk about the cost benefits of GaN
Tuesday 28th May 2024
ST launches wireless charging design
Tuesday 28th May 2024
AOD introduces space-saving half-bridge MOSFET
Tuesday 28th May 2024
Infineon unveils 400V CoolSiC MOSFETs
Thursday 23rd May 2024
Navitas drives next-gen power semis at PCIM 2024
Thursday 23rd May 2024
Toshiba completes 300 mm fab for power semis
Thursday 23rd May 2024
Turning up the heat on GaN
Wednesday 22nd May 2024
Transphorm to showcase SuperGaN at PCIM 2024
Wednesday 22nd May 2024
Soitec and Tokai Carbon enter into SiC partnership
Wednesday 22nd May 2024
Wise-integration and Leadtrend introduce GaN SiP
Wednesday 22nd May 2024
X-FAB and Soitec team up on SmartSiC
Tuesday 21st May 2024
Power Integrations launches drivers for dual IGBT modules
Tuesday 21st May 2024
Nexperia SiC MOSFETs now in D2PAK-7
Tuesday 21st May 2024
Empowering innovation at PCIM
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