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Thursday 7th September 2023
Toshiba introduces power devices for BLDC motor drives
Wednesday 6th September 2023
Navitas launches GaNSafe
Wednesday 6th September 2023
MRSI introduces high force die bonder
Wednesday 6th September 2023
Volvo Cars Tech Fund invests in start-up Leadrive
Tuesday 5th September 2023
Shin-Etsu Chemical promotes QST substrate business
Monday 4th September 2023
BorgWarner uses ST SiC tech in Volvo modules
Monday 4th September 2023
ST boosts IGBT ruggedness and efficiency
Monday 4th September 2023
Breakthrough in diamond p-type lateral SBDs
Monday 4th September 2023
Rohm announces new EcoGaN chips
Thursday 31st August 2023
Another step forward in the ‘waves of electrification’
Thursday 31st August 2023
Toshiba 3rd gen SiC MOSFETs reduce switching losses
Wednesday 30th August 2023
Alpha and Omega introduce MRigidCSP
Wednesday 30th August 2023
Innoscience signs new design-in partner
Tuesday 29th August 2023
Bel adds dual output DC-DC converter
Tuesday 29th August 2023
The growth of power SiC partnerships
Tuesday 29th August 2023
Mitsubishi completes 12-inch line at power chip fab
Tuesday 29th August 2023
Vishay's 650V MOSFET slashes on-resistance
Tuesday 29th August 2023
Toshiba launches 2200V dual SiC MOSFET module
Thursday 24th August 2023
Toshiba releases small 600V devices for brushless DC motors
Thursday 24th August 2023
Transphorm GaN powers DAH Solar PV systems
Wednesday 23rd August 2023
Infineon expands TRENCHSTOP IGBT family
Wednesday 23rd August 2023
Wolfspeed to sell RF business to Macom
Monday 21st August 2023
Yole unpacks power module packaging
Thursday 17th August 2023
Spark and Infineon unveil 500W wireless charger
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