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News
Thursday 6th July 2023
Toyo Ink introduces Nano-Ag sintering paste
Thursday 6th July 2023
GaN chip firms confirm continued supply
Thursday 6th July 2023
3D-Micromac shows latest tools at Semicon West
Wednesday 5th July 2023
Nexperia enters IGBT market
Wednesday 5th July 2023
Renesas and Wolfspeed sign 10 year SiC wafer agreement
Tuesday 4th July 2023
China to put export controls on compound semi materials
Monday 3rd July 2023
Melexis motor driver boosts new functions for EVs
Monday 3rd July 2023
NexGen and General Motors get DOE grant
Monday 3rd July 2023
OnePlus uses Innoscience bidirectional VGaN HEMTs
Monday 3rd July 2023
Navitas and Plexim accelerate time-to-market
Thursday 29th June 2023
STIHL awards Infineon 'Supplier of the Year '
Thursday 29th June 2023
Halo introduces 40W UFCS charger chip
Thursday 29th June 2023
Toshiba releases 100V N-channel MOSFET
Thursday 29th June 2023
Transphorm Q4 and yearly revenue down
Thursday 29th June 2023
Toyoda Gosei and Powdec develop horizontal GaN device
Wednesday 28th June 2023
Littlefuse to buy Elmos Semi fab
Wednesday 28th June 2023
Diodes Inc announces automotive SiC MOSFETs
Tuesday 27th June 2023
Substrates market to exceed $264M by 2028
Tuesday 27th June 2023
ST adds galvanically isolated high-side switches
Tuesday 27th June 2023
Wolfspeed announces $1.25B funding led by Apollo
Monday 26th June 2023
Airbus and ST collaborate on power chips for e-planes
Monday 26th June 2023
Vitesco and Rohm sign SiC supply partnership
Monday 26th June 2023
Nexperia broadens MOSFET package options
Tuesday 20th June 2023
Toshiba launches 600V super junction N-channel power MOSFET
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