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Company News

News

Wednesday 10th June 2026

Taiwan Semi introduces AEC-Q 40/60V MOSFETs

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Tuesday 9th June 2026

SemiQ expands QSiC module range for SSTs and AC-DC

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Tuesday 9th June 2026

CGD and NXP to collaborate on application solutions

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Tuesday 9th June 2026

Onsemi introduces GaNEXUS range

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Tuesday 9th June 2026

Nexperia brings QDPAK packaging to 1200V SiC MOSFETs

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Tuesday 9th June 2026

EPC adds compact 3-phase BLDC motor drive inverter

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Tuesday 9th June 2026

Rohm launches top-side cooling package for SiC MOSFETs

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Monday 8th June 2026

Onsemi introduces tool to simplify power design

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Monday 8th June 2026

Navitas introduces new package for HV SiC MOSFETs

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Monday 8th June 2026

QPT's AI-driven design service optimises die attach in days

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Monday 8th June 2026

Toshiba launches complementary 30V dual MOSFET

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Monday 8th June 2026

Infineon and Siemens partner on SiC circuit breakers

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Thursday 4th June 2026

CGD's 650V ICeGaN devices improve EV range

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Thursday 4th June 2026

EPC targets motion systems with GaN ePower stage ICs

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Thursday 4th June 2026

Wise to unveil digital control roadmap at PCIM 2026

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Thursday 4th June 2026

Rohm SiC MOSFET adopted in HVDC AI servers

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Thursday 4th June 2026

Navitas shows DC-DC board at NIVDIA event

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Thursday 4th June 2026

Vishay 200A module saves space in MHEVs and LEVs

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Tuesday 2nd June 2026

Fraunhofer IAF to show GaN4EmoBil module at PCIM

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Tuesday 2nd June 2026

EPC supports NVIDIA MGX with 800V-to-12.5V design

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Monday 1st June 2026

QPT starts demos of MicroDyno

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Monday 1st June 2026

Rohm launches PLECS simulator

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Monday 1st June 2026

PI announces PowiGaN designs for 800 VDC AI data centres

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Monday 1st June 2026

Infineon introduces first 205degC SiC power module