VIDEO
Imec advances 2D-material based device technology
Video Summary
Gouri Sankar Kar, VP R&D compute and memory device technologies at imec, explains how the research organisation, in collaboration with leading semiconductor manufacturers, has addressed key challenges in advancing 2D-material device technology, which is considered a long-term option for extending the logic technology roadmap. Collaboration with TSMC resulted in record performing WSe2 -based pFETs (with Imax as high as 690µA/µm), using a fab-compatible process flow. Partnership with Intel led to improved fab-compatible modules for source/drain contact formation and gate stack integration (with reduced equivalent oxide thickness (EOT)).
