VIDEO
TI unveils high-performance isolated power modules
Video Summary
David Snook, Product Line Manager at Texas Instruments, outlines the technologies behind the launch of new isolated power modules, which help to enable increased power density, efficiency and safety in applications ranging from data centres to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI’s IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs – packing more power into smaller spaces while reducing area, cost and weight.
