Eaton to use Infineon SiC chips for SSTs
Infineon will deliver SiC power devices to Eaton, a power management company, for use in its medium-voltage solid-state transformer (MVSST) 2.0 platform designed for deployment across APAC.
The collaboration will help increase the efficiency and reliability of the power conversion required to connect AI data centres to the electricity grid. It targets 800Volts direct current (VDC) data centre power distribution architectures.
The rapid expansion of AI data centres and rising power requirements are driving demand for more efficient ways to connect high-density computing infrastructure to the grid. At the same time, advances in medium-voltage DC distribution technologies are accelerating the need for next-generation power conversion solutions that can improve efficiency, power density, scalability and reliability.
"As energy demand from AI data centres and industrial applications continues to grow, the demand for efficient, reliable and sustainable power conversion is increasing," said Andreas Weisl (pictured above), executive VP and chief sales officer of Industrial & Infrastructure at Infineon. "By joining forces with Eaton, we aim to advance solid-state transformer technology and contribute to the development of a more scalable, efficient and sustainable infrastructure for powering the AI data centres of the future."
David Zheng, VP of R&D for Power Quality in APAC at Eaton said: "Against the backdrop of rapidly increasing requirements for power efficiency, system reliability and scalability in AI data centres, our goal is to advance the development and adoption of SST technology. Thus, we aim to create greater value for data centre and power grid operators as well as the renewable energy sector.
"Infineon’s advanced SiC technology is helping us accelerate the deployment of these next-generation power architectures."
Designed for high-density computing infrastructures and emerging 800 VDC AI data centre power distribution architectures, Eaton’s MVSST 2.0 platform reduces conversion stages compared with conventional architectures, improving efficiency, power density and deployment flexibility.
Looking ahead, Eaton and Infineon are exploring next-generation SST platforms based on 2.3 kV and 3.3 kV SiC power modules to support higher system voltages, greater efficiency and enhanced reliability for future AI data centres, grid modernisation and renewable energy applications.
