Toshiba shows latest power solutions at APEC 2026
Toshiba America Electronic Components will be at the Applied Power Electronics Conference (APEC) this week to highlight its latest power semiconductor technologies enabling more intelligent, efficient, and sustainable system designs.
The company’s portfolio includes silicon, SiC, and GaN FETs; IGBTs; optical and digital isolation devices; motor control solutions; microcontrollers; protection ICs such as eFuses; and a wide range of other general-purpose semiconductor devices.
At APEC 2026, Toshiba will feature several new products and technology updates. These include an expanded portfolio of UMOS 11 MOSFETs in industry-standard packages featuring improved switching characteristics and reduced RDS(on) per area compared to the previous UMOS 10 generation. Also, a top-side cooled TOGT package engineered for thermally demanding, high power-density applications, enabling heat dissipation through the top of the package to reduce thermal stress on the PCB.
The company will also show high SiC power modules for grid-level and industrial systems using Toshiba’s latest SiC process technology. And 750V and 1200V SiC die and modules for automotive drivetrain inverter applications.
Ongoing development of low-voltage and high-voltage GaN technologies will be another highlight, with additional product updates planned later this year.
System reference designs demonstrations include high-efficiency power supply platforms such as 3kW server PSUs for data centre applications, automotive ECU power architectures, and motor control reference designs for pump and power tool systems.
