TI unveils high-performance isolated power modules
Texas Instruments (TI) has unveiled new isolated power modules, helping to increase power density, efficiency and safety in applications ranging from data centres to electric vehicles (EVs).
The UCC34141-Q1 and UCC33420 isolated power modules use TI's IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC).
"Packaging innovation is revolutionising the power industry, with power modules at the forefront of this transformation," said Kannan Soundarapandian, vice president and general manager, High Voltage Products at TI. "TI's new IsoShield technology delivers what power engineers need most: smaller solutions with improved efficiency and reliability and a faster time to market. It is the latest example of TI's continued commitment to advance power semiconductor technology to help solve today's engineering challenges."
Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process. As chip sizes reach their physical limits and miniaturisation increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.
TI's new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result, says TI, is a packaging advancement that shrinks solution size by as much as 70 percent while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data centre applications that require reinforced isolation.
